XUMH9N H9 的参数 |
| 集电极-基极反向击穿电压V(BR)CBO
Collector-Base Voltage(VCBO) |
50V |
| 集电极-发射极反向击穿电压V(BR)CEO
Collector-Emitter Voltage(VCEO) |
50V |
| 集电极连续输出电流IC
Collector Current(IC) |
70mA |
| Q1基极输入电阻R1
Input Resistance(R1) |
10KΩ/Ohm |
| Q1基极-发射极输入电阻R2
Base-Emitter Resistance(R2) |
47KΩ/Ohm |
| Q1电阻比(R1/R2)
Q1 Resistance Ratio |
0.21 |
| Q2基极输入电阻R1
Input Resistance(R1) |
10KΩ/Ohm |
| Q2基极-发射极输入电阻R2
Base-Emitter Resistance(R2) |
47KΩ/Ohm |
| Q2电阻比(R1/R2)
Q2 Resistance Ratio |
0.21 |
| 直流电流增益hFE
DC Current Gain(hFE) |
|
| 截止频率fT
Transtion Frequency(fT) |
250MHz |
| 耗散功率Pc
Power Dissipation |
150mW/0.15W |
| Description & Applications |
Features ? General purpose (dual digital transistors) ? Two DTC114Ys chips in a EMT or UMT or SMT package. ? Mounting possible with EMT3 or UMT3 or SMT3 automatic mounting machines. ? Transistor elements are independent, eliminating interference. ? Mounting cost and area can be cut in half |
| 描述与应用 |
特点 ?通用（双数字晶体管） ?两个DTC114Ys芯片在EMT或UMT或SMT封装。 ?安装可能与EMT3或UMT3或SMT3自动安装机器。 ?晶体管元素是独立的，消除干扰。 ?安装成本和面积可减少一半 |
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